JPH0376591B2 - - Google Patents
Info
- Publication number
- JPH0376591B2 JPH0376591B2 JP59027483A JP2748384A JPH0376591B2 JP H0376591 B2 JPH0376591 B2 JP H0376591B2 JP 59027483 A JP59027483 A JP 59027483A JP 2748384 A JP2748384 A JP 2748384A JP H0376591 B2 JPH0376591 B2 JP H0376591B2
- Authority
- JP
- Japan
- Prior art keywords
- region
- type
- forming
- conductivity type
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/101—Integrated devices comprising main components and built-in components, e.g. IGBT having built-in freewheel diode
- H10D84/141—VDMOS having built-in components
- H10D84/148—VDMOS having built-in components the built-in components being breakdown diodes, e.g. Zener diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
- H10D8/20—Breakdown diodes, e.g. avalanche diodes
- H10D8/25—Zener diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
- H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
- H10D89/601—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
- H10D89/611—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs using diodes as protective elements
Landscapes
- Element Separation (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59027483A JPS60170975A (ja) | 1984-02-16 | 1984-02-16 | 縦型mosfetの製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59027483A JPS60170975A (ja) | 1984-02-16 | 1984-02-16 | 縦型mosfetの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60170975A JPS60170975A (ja) | 1985-09-04 |
JPH0376591B2 true JPH0376591B2 (en]) | 1991-12-05 |
Family
ID=12222374
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59027483A Granted JPS60170975A (ja) | 1984-02-16 | 1984-02-16 | 縦型mosfetの製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60170975A (en]) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62111445A (ja) * | 1985-11-08 | 1987-05-22 | Matsushita Electronics Corp | 半導体装置の製造方法 |
US5702957A (en) * | 1996-09-20 | 1997-12-30 | Lsi Logic Corporation | Method of making buried metallization structure |
CN102412307A (zh) * | 2010-09-26 | 2012-04-11 | 上海华虹Nec电子有限公司 | 垂直的齐纳二极管结构及其制备方法 |
-
1984
- 1984-02-16 JP JP59027483A patent/JPS60170975A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS60170975A (ja) | 1985-09-04 |
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